Mechanical Properties and Evolution Behaviors of Different Sn63Pb37 Solders Under Reliability Test
Chen Liu,Qin Wang,Jing He,Zhichao Meng,Zhenyuan Li,Shanshan Cai
DOI: https://doi.org/10.1109/ICEPT63120.2024.10668629
2024-08-07
Abstract:Sn63Pb37 solder alloys had been widely used in the electronic package and material connection in the past two decades. Now, Because Pb toxicity had a harmful impact on the environment and human health, people put forward to reduce the pollution caused by Pb in solder alloys and make efforts to replace SnPb solder. However, SnPb solder could not be replaced in space environment, extreme temperature and other area which had a great demand on reliability. Microelement addition had a great influence on the solders properties. Generally, Microelement can reduce the solder melting point and improve mechanical properties. In this work, we compared two kinds of Sn63Pb37 solders with different microelement. The properties of two kinds of solders were characterized, and the welded joints under temperature cycling and high-temperature storage were compered. Firstly, the composition of two solder balls was analyzed using ICP, and then the mechanical properties of the solder were characterized using nanoindentation, hardness, and other methods. Two types of solder were respectively welded onto PCB boards with copper solder pads. After temperature cycling and high-temperature storage, the growth mechanism of intermetallic compounds at the interface, as well as the changes in defects such as cracks and pores were studied. This provides guidance for the further application of SnPb solder.
Materials Science,Engineering