Interfacial and Electrical Characterization of HfO2 Gate Dielectric Film with a Blocking Layer of Al2O3

Xinhong Cheng,Dawei He,Zhaorui Song,Yuehui Yu,Qing-Tai Zhao,DaShen Shen
DOI: https://doi.org/10.1109/ulis.2009.4897572
2009-01-01
Rare Metal Materials and Engineering
Abstract:HfO 2 gate dielectric films with a blocking layer of Al 2 O 3 inserted between HfO 2 /Si were treated with rapid thermal annealing process at 700degC. The interfacial structure and electrical properties are reported. X-ray photoelectron spectroscopy indicated that the interfacial layer of SiO x transformed into SiO 2 after the annealing treatment, and Hf-silicates and Hf-silicides were not detected. High-resolution transmission electron microscopy showed that the interfacial layer was composed of SiO 2 for the annealed film with a blocking layer. The electrical measurements indicated that the equivalent oxide thickness decreased to 2.5 nm and the fixed charge density decreased to -4.5times10 11 /cm 2 in comparison with the same thickness of HfO 2 films without the blocking layer. Al 2 O 3 layer could effectively prevent the diffusion of Si into HfO 2 film and improve the interfacial and electrical performance of HfO 2 film.
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