Notes on the First International Symposium on Microelectronic Package and PCB Technology, Beijing P. R. China

Zeng-Yuan Guo
DOI: https://doi.org/10.1115/1.2905693
1994-01-01
Journal of Electronic Packaging
Abstract:The Symposium which took place September 19-23 on the Tsinghua University campus, was a notable success. We heard 50 talks embracing close to the entirety of a vast technological subject. It was gratifying to have some of the best research and development engineers and scientists from the U.S.A. and Japan, and the rest of the international community among the presenters; this lent additional substance and weight to the meeting.
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