Effect of Si Content on Microstructure and Property of High Silicon Aluminum Alloy

YANG Fuliang,GAN Weiping,CHEN Zhaoke
DOI: https://doi.org/10.3321/j.issn:1005-023X.2005.02.029
2005-01-01
Abstract:Light high-silicon aluminum alloy is used for electronic packaging in the aviation and space-flight, here we call it hypereutectic high-silicon aluminum alloy.Al-30Si and Al-40Si can be fabricated with a method in which air-atomization is followed by vacuum canning hot-extrusion process.Optical microscopy,universal material testing machine,thermal analyzer and TR-2 thermal physics testing are used to study the microstructure,material thermal conductivity,thermal expansion coefficient and tensile strength.Experimental results show that,when Si content in alloy is increase,the size of silicon crystal is larger after hot-extrusion,material thermal conductivity is down,thermal expansion coefficient and the tensile strength is lower.
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