Abstract:The thermal degradation behaviors of phenylethynyl-terminated polyimide and their carbon fiber reinforced composites (CFRC) are significant to be evaluated comprehensively as their high-temperature applications are gradually expanded. It is found that ether-containing thermoset polyimide (PI) film shows unique degradation behaviors near glass transition temperature ( T g ). Though the triethylamine (Et 3 N) chemical imidization method is applied, the PI backbone shows thermal stability at 371°C thermo-oxidation condition and the main degradation parts site at the curing structure. More aliphatic (C-C) linkages will be formed in the thermo-oxidation process and they are ascribed to the further crosslinking behaviors of polyene structure. However, the PI film shows stable mechanical properties after thermo-oxidation. Meanwhile, the formation of an amorphous carbon structure is found after thermo-oxidation treatment, which endows the composite with enhanced electrical properties. Though the micro-cracking phenomenon happens at the matrix/CF interface of composite surface and thus degrades its mechanical properties, the in-plane longitudinal and transverse conductivity of the composite perform an increase, factors of 1.13 to 2.56×10 4 S/m and 2.28 to 454.8 S/m, respectively. Mechanism study indicates that the formation of amorphous carbon components is caused by the structural rearrangement of the degrading polyene curing structure and becomes more in the thermo-oxidation process, not affecting the backbone integrity and mechanical stability of the PI matrix. As a result, thermo-oxidation treatment degrades the mechanical properties of the composite, whereas the formed amorphous carbon component acts as a self-growing carbon-based nano-filling structure at the PI/CF interface and enhances the electrical contact of the carbon fibers.

Thermo-Mechanical Properties of Thermoplastic Polyimide Foams

Preparation and Dielectric Properties of Polyimide Foams Containing Crosslinked Structures

Preparation and Property of Polyimide Foams

Studies on Polyimide Foams Prepared from Poly(Ester-amine Salt) Precursor Powder

Polyimide Foams with Ultralow Dielectric Constants

Closed-Cell Rigid Polyimide Foams for High-Temperature Applications: The Effect of Structure on Combined Properties

Polyether–polyimide Thermoplastic Elastomers. I. Synthesis and Properties

Preparation and Properties of High-Temperature-Resistant, Lightweight, Flexible Polyimide Foams with Different Diamine Structures

STUDY ON THE SYNTHESIS AND PROPERTIES OF POLYIMIDE FOAMS

Characterization and modeling of the uniaxial thermo-mechanical compressive behavior of polymethacrylimide (PMI) foam at different temperatures

Compressive Mechanical Behavior and Corresponding Failure Mechanism of Polymethacrylimide Foam Induced by Thermo-Mechanical Coupling

Characterization and Thermal Degradation of Polyimide Derived from 5-Amino-2(p-aminophenyl) Benzoxazole Monomer with Pyromellitic Dianhydride

Synthesis and Characterization of Thermoplastic Polyether-imide Elastormer

MD analysis on structure and property of thermosetting polyimides end-capped by phenylethynyl groups

Thermogravimetry of Thermoplastic Polyimide Powders under Four Different Atmospheres

Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Surface Modification of Polyimide Aerogel by Thermoplastic Polyurethane for Enhanced Mechanical Strength and Thermal Insulation Performance

INFLUENCE OF THE CHEMISTRY OF THE FOAMING COMPOSITION ON THERMAL AND MECHANICAL PROPERTIES OF THE FORMING POLYIMIDE FOAM

Synthesis And Characterization Of A New High Temperature Shape Memory Polyimide

Effect of high-temperature thermo-oxidation on the mechanical and electrical properties of phenylethynyl-terminated polyimide/carbon fiber composite

Dielectric and Thermal Properties of Polyimide–Poly(ethylene Oxide) Nanofoamed Films