Effect of Annealing Ambient on the Thermal Stability of Cu/Zr42si9n49/Si Contact System

Y Wang,CC Zhu,ZX Song,CY Wu
DOI: https://doi.org/10.1016/j.matlet.2004.03.009
IF: 3
2004-01-01
Materials Letters
Abstract:Cu/Zr42Si9N49/Si contact systems were deposited by direct current-pulsed magnetron sputtering (DC-PMS) technique. The contact systems were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), Auger electron spectroscopy (AES) and four-point probe sheet resistance measurements (Rs), respectively. The sheet resistances of Cu/Zr42Si9N49/Si contact systems annealed in N2/H2 gas mixture were lower than those of specimens annealed in vacuum at 800 °C. It is evident that the residual oxygen contamination from vacuum annealing ambience can affect the sheet resistances of Cu/Zr42Si9N49/Si contact systems. Compared with vacuum annealing, the thermal stabilities of the contact systems were generally improved after annealing in N2/H2 gas mixture.
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