Influence of Aluminum Deposition Temperature on the Property of Polycrystalline Silicon Films by Aluminum-Induced Crystallization

CHEN Haili,SHEN Honglie,ZHANG Lei,YANG Chao,LIU Bin
DOI: https://doi.org/10.3969/j.issn.1005-9490.2011.04.005
2011-01-01
Abstract:It was studied that the property of the polycrystalline silicon films was influenced by the aluminum depossition temperature in process of the Aluminum-Induced Crystallization(AIC).Initial amorphous silicon films were deposited on the ultra-white glass substrate by hot wire chemical vapor deposition and then were subjected to air oxidation.After initial Al films were deposited by magnetron sputtering at different temperature,a-Si/SiO_2/Al multilayer structure was formed.Thenα-Si film in the a-Si/SiO_2/Al structure was induced to form a polycrystalline silicon film by Aluminum-Induced Crystallization process.The induced films were characterized with X-ray diffraction, optical microscopy and Raman spectroscopy.The results showed that as the aluminum deposition temperature rose,the grain size of the polycrystalline silicon decreased after annealing and the crystallization ability and quality degraded. When the aluminum deposition temperature reached above 200℃,AIC phenomenon could not occur.
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