Mass Transferring Trend of TiC Coating on Copper Electrode Surface Deposited by Electrospark

LUO Cheng,DONG Shijie,XIONG Xiang
DOI: https://doi.org/10.3969/j.issn.1001-3814.2010.24.048
2010-01-01
Abstract:The mass transferring trend was discussed by recording the mass of coating every 30 s during deposition.The results indicate that the mass of the coating develops along a parabolic curve.The deposition velocity is higher at the beginning and stabilizes gradually after deposition for 120 s.The deposition velocity is primarily influenced by evaporation of copper and TiC,cutting of the rod,flaking and cracking of the brittle coating.The evaporation will be greater with the increase of pulse energy,which decreases the mass increase of the coating.In order to obtain better coating,higher voltage should be utilized and deposition time should be limited to 120 s.
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