Abstract:Sn-Cu based solders have been widely investigated due to their good mechanical properties, good fluidity, narrow melting range, environmental friendliness, and low price. In this paper, the effect of Ni content on the microstructure, mechanical properties, melting behavior, spreadability, and conductivity of Sn-0.7 Cu-xNi (0.5-2.0 mass%, mass fraction except when specified) lead-free solders was studied. The Sn-0.7Cu-xNi (x = 0.5, 1.0, 1.5, and 2.0) solder alloys consisted of a β-Sn solid solution, Ni3Sn4 phase, and Cu6Sn5 phase. The volume fraction of Ni3Sn4 increased with increasing Ni content. The addition of Ni increased the solidus and liquidus temperatures of the Sn-0.7Cu-xNi solder alloys. However, the melting range of the Sn-0.7Cu-0.5Ni and Sn-0.7Cu-1.0Ni solder alloys is lower than that of the Sn-0.5Cu solder alloy. The spreading area of the Sn-0.7Cu-xNi solder alloy first increased and then decreased with increasing Ni content. Moreover, the ultimate tensile strength and hardness of the Sn-0.7Cu-xNi solder alloy increased gradually with increasing Ni content. The Sn-0.7Cu-2.0Ni alloy has maximum ultimate tensile strength and hardness values of 52.01 MPa and 16.45 Hv, respectively. However, the electrical conductivity of the Sn-0.7Cu-xNi solder alloy decreased with increasing Ni content. These changes in performance related to the formation of the intermetallic Ni3Sn4 phase. The Sn-0.7Cu-1.0Ni solder alloy had the best comprehensive performance in the present experiment. For the Sn-0.7Cu-1.0Ni solder alloy, the expanded area was 1.28 times that of the Sn-0.7Cu alloy, and the liquidus temperature, melting range, strength, hardness, and resistivity of the alloy solder were at the intermediate level among the Sn-0.7Cu-xNi solder alloys. Therefore, the Sn-0.7Cu-1.0Ni alloy is a relatively ideal solder alloy with a good comprehensive performance among the Sn-0.7Cu-xNi solder alloys.

Microstructure,Mechanical Property and Interfacial Reaction of Sn-Cu Based Multicomponent Lead-Free Solders

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints

Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint

Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys

Effects of Multiple Reflows on Sn3.8Ag0.7Cu-xNi/Ni Solder Joints

Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

Properties of Sn-Ag-Cu Lead Free Solders with Different Silver Content

Dissolution and Interfacial Reactions of (cu,ni)6sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders

Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam

Effect of Nano-Cu 6 Sn 5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Study on the properties of low silver Sn1.0Ag0.5Cu composite solder reinforced with nickel-plated zinc oxide and its soldering joint

Research Development of Compound Cu6Sn5 Between Sn-based Lead-Free Solders and Cu Substrate

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

Effect of in Addition on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.8Zn/Cu Solder Joints

Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition

Microstructure and tensile properties of Sn-1Cu lead-free solder alloy produced by directional solidification

Effects of Addition Small Amount High Melting Point Metal on Properties of Lead-free Solders