Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Huang He,Shangyu Huang,Yongchao Ye,Yong Xiao,Zhihao Zhang,Mingyu Li,Russell Goodall

DOI: https://doi.org/10.1016/j.jallcom.2020.156240

IF: 6.2

2020-12-01

Journal of Alloys and Compounds

Abstract:<p>In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based composite solders at 260 °C for different times. The tensile strength of pure Sn solder was improved significantly by the addition of metal foams, and the Cu-Ni alloy/Sn composite solder exhibited the highest tensile strength of 50.32 MPa. The skeleton networks of the foams were gradually dissolved into the soldering seam with increasing soldering time, accompanied by the massive formation of (Cu,Ni)₆Sn₅ phase in the joint. The dissolution rates of Ni foam, Cu coated Ni foam and Cu-Ni alloy foams into the Sn matrix increased successively during soldering. An increased dissolution rate of the metal foam leads to an increase in the Ni content in the soldering seam, which was found to be beneficial in refining the (Cu,Ni)₆Sn₅ phase and inhibiting the formation of the Cu₃Sn IMC layer on the Cu substrate surface. The average shear strength of the Cu joints was improved with increasing soldering time, and a shear strength of 61.2 MPa was obtained for Cu joints soldered with Cu-Ni alloy/Sn composite solder for 60 min.</p>

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering