Abstract:The diminutive additions of nickel (Ni) element have been fused to Sn-1.5Ag-0.5 mass% Cu (SAC155) lead-free solder alloy. The study was examined experimentally and computationally (using JMatPro software program) the microstructural features, thermal behavior, density, thermal diffusivity, and conductivity as well as tensile stress strain of the Sn-1.5Ag-0.5Cu-x mass %Ni (x = 0.00, 0.05, 0.10, 0.20, and 0.50) solder alloys (SAC155-xNi). The fusing additions of Ni have a little impact on the melting point of SAC155 alloy which increasing from 502 to . The microstructure of SAC155 solder alloy included coarse grains of β-Sn besides, large eutectic regions, and embedded IMCs of Ag 3 Sn and Cu 6 Sn 5 . The computed values of Gibbs free energy (G) during solidification of the β-Sn phase, Ag 3 Sn, and Sn 3 Sn 4 IMCs show the stability at , , and , respectively. The SAC155-xNi alloys involved finer β-Sn grains, large fibrous eutectic regions, (Cu,Ni) 6 Sn 5 and (Cu,Ni) 3 Sn 4 IMCs. The G of Cu 6 Sn 5 decreased from to when Ni content increased up to 0.25 mass %, then stable and steady at with more addition of Ni element. The formation of the (Cu, Ni) 6 Sn 5 and (Ni, Cu) 3 Sn 4 IMCs is motivated by the lowest Gibbs free energy, especially when Ni mass% is added to a sufficient level. The measured and computed values of specific heat at constant pressure ( C p ) of SAC155-xNi alloys show a good matching especially at lower temperatures and a little mismatch at high temperatures which decreases with increasing Ni content. The activation energy of atomic arrangement (Q) increased from 11.36 to with increasing Ni content in SAC155-xNi alloys. Thermal diffusivity (α) and conductivity (κ) of SAC155-xNi gradually decreased with increasing temperature in the range from 303 to 423 K and/or Ni content in alloys. The measured values of (κ) are slightly lower than the computed value at similar temperatures of the SAC155-xNi alloys. The decrease in (κ) may be assigned to scattering the electrons or reducing the phonon contributions due to the presence of various solute atoms and different IMCs. The results of stress-strain graphs reveal the enhancement of YS and UTS for all Ni-containing alloys. The improvement of the yield stress (YS) and ultimate tensile strength (UTS) of Ni-containing alloys is attributed to the uniform distribution of the IMCs, the reduction of β-Sn grain size, and the smoothed enlargement of the eutectic region.

Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint

Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys

The role of Ni minor additions on the mechanical characteristics of Sn-1.5Ag-0.5 wt.% Cu (SAC155) Pb-free solder alloy

Effect of Nano-Cu 6 Sn 5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys

Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles

Intermetallic and tensile study of the newly developed Sn-2.0Ag-0.7Cu solder with addition of 0.5 wt.% zinc

Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints

Effects of Multiple Reflows on Sn3.8Ag0.7Cu-xNi/Ni Solder Joints

Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification

Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength

The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

Effects of Ni-decorated reduced graphene oxide nanosheets on the microstructural evolution and mechanical properties of Sn-3.0Ag-0.5Cu composite solders

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Effect of Ni content on the creep properties of Cu/Sn–0.3Ag–0.7Cu/Cu solder micro-joints

Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam

Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

Microstructure and shear property of Ni-coated carbon nanotubes reinforced InSn-50Ag composite solder joints prepared by transient liquid phase bonding