Abstract:The diminutive additions of nickel (Ni) element have been fused to Sn-1.5Ag-0.5 mass% Cu (SAC155) lead-free solder alloy. The study was examined experimentally and computationally (using JMatPro software program) the microstructural features, thermal behavior, density, thermal diffusivity, and conductivity as well as tensile stress strain of the Sn-1.5Ag-0.5Cu-x mass %Ni (x = 0.00, 0.05, 0.10, 0.20, and 0.50) solder alloys (SAC155-xNi). The fusing additions of Ni have a little impact on the melting point of SAC155 alloy which increasing from 502 to . The microstructure of SAC155 solder alloy included coarse grains of β-Sn besides, large eutectic regions, and embedded IMCs of Ag 3 Sn and Cu 6 Sn 5 . The computed values of Gibbs free energy (G) during solidification of the β-Sn phase, Ag 3 Sn, and Sn 3 Sn 4 IMCs show the stability at , , and , respectively. The SAC155-xNi alloys involved finer β-Sn grains, large fibrous eutectic regions, (Cu,Ni) 6 Sn 5 and (Cu,Ni) 3 Sn 4 IMCs. The G of Cu 6 Sn 5 decreased from to when Ni content increased up to 0.25 mass %, then stable and steady at with more addition of Ni element. The formation of the (Cu, Ni) 6 Sn 5 and (Ni, Cu) 3 Sn 4 IMCs is motivated by the lowest Gibbs free energy, especially when Ni mass% is added to a sufficient level. The measured and computed values of specific heat at constant pressure ( C p ) of SAC155-xNi alloys show a good matching especially at lower temperatures and a little mismatch at high temperatures which decreases with increasing Ni content. The activation energy of atomic arrangement (Q) increased from 11.36 to with increasing Ni content in SAC155-xNi alloys. Thermal diffusivity (α) and conductivity (κ) of SAC155-xNi gradually decreased with increasing temperature in the range from 303 to 423 K and/or Ni content in alloys. The measured values of (κ) are slightly lower than the computed value at similar temperatures of the SAC155-xNi alloys. The decrease in (κ) may be assigned to scattering the electrons or reducing the phonon contributions due to the presence of various solute atoms and different IMCs. The results of stress-strain graphs reveal the enhancement of YS and UTS for all Ni-containing alloys. The improvement of the yield stress (YS) and ultimate tensile strength (UTS) of Ni-containing alloys is attributed to the uniform distribution of the IMCs, the reduction of β-Sn grain size, and the smoothed enlargement of the eutectic region.

The role of Ni minor additions on the mechanical characteristics of Sn-1.5Ag-0.5 wt.% Cu (SAC155) Pb-free solder alloy

Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys

Effect of Ni content on the creep properties of Cu/Sn–0.3Ag–0.7Cu/Cu solder micro-joints

Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint

Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions

The role of Sb on the microstructure and creep behaviors of Sn–6.5Zn–0.3Cu Pb-free solder alloy

Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys

The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

Intermetallic and tensile study of the newly developed Sn-2.0Ag-0.7Cu solder with addition of 0.5 wt.% zinc

The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications.

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu

Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te

Electrochemical corrosion behaviour of Zn-Sn-Cu-xNi lead-free solder alloys

Effect of Nano-Cu 6 Sn 5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures

Effect of Ni-CNTs on Wetting Properties, Microstructure, and Creep Resistance of Sn58Bi-0.1Er Composite Solder

Effects of Ni-decorated reduced graphene oxide nanosheets on the microstructural evolution and mechanical properties of Sn-3.0Ag-0.5Cu composite solders

Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification