Effect of Ni-CNTs on Wetting Properties, Microstructure, and Creep Resistance of Sn58Bi-0.1Er Composite Solder

Qi Li,FengMei Liu,Yaoyong Yi,Xueying Zhang,Haitao Gao

DOI: https://doi.org/10.1109/icept52650.2021.9568164

2021-01-01

Abstract:Sn-58Bi-0.1Er solder alloys with different Ni-CNTs contents were prepared by vacuum melting, the influence of Ni-CNTs content on the wetting properties of Sn-58Bi-0.1Er solder was studied. The interface morphology of IMC at Sn-58Bi-0.1Er/Cu joint and the creep resistance of Sn-58Bi-0.1Er/Cu joints with different contents of Ni-CNTs were analyzed. The results showed that when added 0.01~0.05 wt% Ni-CNTs, it enhanced the wettability of composite solder alloy on Cu plate, and the inter metallic compound of Sn58Bi/Cu interface changed from sawtooth Cu6Sn5 to thin layer (Cu, Ni)6Sn5. With the increase amount of Ni-CNTs enhanced particles, it can effectively reduce the thickness of IMC layer at the Sn58Bi-0.1Er/Cu interface. By adding Ni-CNTs particles, the creep fracture life of Sn58Bi-0.1Er/Cu joints was greatly improved. The creep fracture life of the joint was the longest when 0.03 wt%Ni-CNTsadded, which was 25650s. The addition of Ni-CNTs reinforcement particles effectively improved the mechanical properties of the Sn58Bi joint.