Abstract:Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints before and after an electro-migration (EM) experiment. Design/methodology/approach In this paper, SAC305 solder alloy doped with 0.1 Wt.% Ni-GNS was prepared via the powder metallurgy method. A U-shaped sample structure was also designed and prepared to conduct an EM experiment. The EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both solder joints under EM stressing were comparatively studied using SEM and nanoindentation. Findings The experimental results showed that for the SAC305 solder, the interfacial intermetallic compounds (IMC) formulated a protrusion with an average height of 0.42 µm at the anode after 360 h of EM stressing; however, despite this, the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, while the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/ Ni-GNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode side; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, while the hardness data showed a relatively homogeneous distribution in the SAC305/ Ni-GNS solder joint. Originality/value The experimental results showed that the Ni-GNS reinforcement could effectively mitigate the EM behavior in solder joints under high current stressing. Specifically, the Ni particles that plated the graphene sheets can work as a fixing agent to suppress the diffusion and migration of Sn and Cu atoms by forming Sn-Cu-Ni IMC. In addition, the nanoidentation results also indicated that the addition of the Ni-GNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high current densities.

Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn-Ag-Cu solder joints

Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

The Study on Reliability of Ni-coated Graphene Doped SAC305 Lead-Free Composite Solders under High Current-Density Stressing

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Effect of Ni-CNTs on Wetting Properties, Microstructure, and Creep Resistance of Sn58Bi-0.1Er Composite Solder

Microstructure and shear property of Ni-coated carbon nanotubes reinforced InSn-50Ag composite solder joints prepared by transient liquid phase bonding

Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

Effects of Multiple Reflows on Sn3.8Ag0.7Cu-xNi/Ni Solder Joints

Effects of Nanoscale Cu 6 Sn 5 Particles Addition on Microstructure and Properties of SnBi Solder Alloys

Effects of Ni-decorated reduced graphene oxide nanosheets on the microstructural evolution and mechanical properties of Sn-3.0Ag-0.5Cu composite solders

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Effect of Nano-Cu 6 Sn 5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints

Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition

Effect of Ni-CNTs on Microstructure, Thermodynamic Characteristic and Mechanical Properties of Sn58Bi-0.1Er Based Lead-Free Solder

Electromigration and Thermomigration in Sn3Ag0.5Cu Solder Joints

Electromigration Effect Upon the Sn–0.7 Wt% Cu/Ni and Sn–3.5 Wt% Ag/Ni Interfacial Reactions

Wettability and Shear Strength of SAC305 Based Composite Solder with Co-Doping X (ni or Al2O3) and CNTs Reinforcements

Influences of silicon carbide nanowires’ addition on IMC growth behavior of pure Sn solder during solid–liquid diffusion

Influence of Al2O3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints