Stress-Induced Wrinkling of Sputtered Sio2 Films on Polymethylmethacrylate

JR Serrano,QQ Xu,DG Cahill
DOI: https://doi.org/10.1116/1.2171711
2006-01-01
Abstract:Compressively stressed SiO2 films are deposited by rf magnetron sputtering onto polymethylmethacrylate- (PMMA) coated Si substrates. The oxide film roughens by wrinkling during deposition; wrinkling is enabled by the viscous flow of the PMMA layer. The nanoscale lateral length scale of the wrinkling, similar to 120 nm, is established during the first few nanometers of film deposition and is controlled by the thickness and stress of the SiO2 film at the onset of the instability. Continued deposition of SiO2 leads to a rapid increase and then saturation of the rms roughness at similar to 5 nm. (c) 2006 American Vacuum Society.
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