Thermal Stability Analysis and Design for Electrical Product in Short-Circuit Fault
Jing Hao,Jungang Zhou,Yachao Wang
DOI: https://doi.org/10.5755/j02.eie.29521
2022-04-28
Elektronika ir Elektrotechnika
Abstract:In short-circuit faults, the thermal stability of the metal conductor is an important factor for electrical products, which directly affects the safe use of the products. Because it is dangerous to test the thermal stability under short circuit, it is difficult to obtain the required power supply in a conventional laboratory, so at present, the research on thermal stability is mostly based on the theoretical analysis of the finite element method. In this paper, a short-circuit fault is studied. The short-time withstand current test is adopted, in which the current and time can be controlled. First, the results compare three formulas for calculating the current density and verify them. The temperature and current variation of the conductor are calculated and tested. The theoretical results are compared with the experimental results, and the current variation model I is established. Then, the short-time withstand current test is carried out to verify the theoretical calculation, and model II is designed, which is a modification of model I. Finally, a product design method is proposed and verified by experiments. This basic research is the verification test of the theoretical literature, and the research results can be applied to the design of electrical products under short-circuit fault.
engineering, electrical & electronic