Thermal Stability Simulation Analysis of Disconnect Switch Based on Electrical-Thermal Coupling Finite Element Method

YIN Chunhe,XIE Yong,YOU Jiaxin,LIANG Huimin,ZHAI Guofu
DOI: https://doi.org/10.3969/j.issn.1000-6133.2013.02.011
2013-01-01
Abstract:Working performance of switch-disconnect was affected by maximum permissible temperature exceeding which was caused by the heat loss of resistance.3-D finite element analysis model of switch-disconnect was established.It was used for electrical-thermal coupled field simulation analysis for ensuring its safety and reliability.The accuracy of the simulation method was verified with the experimental results.The analysis theory was of academic and practical value for reliability design of switch-disconnect.
What problem does this paper attempt to address?