Cu–C60 interaction and nano-composite structures

J.G Hou,Xiang Li,Haiqian Wang,Bing Wang
DOI: https://doi.org/10.1016/S0022-3697(99)00349-2
IF: 4.383
2000-01-01
Journal of Physics and Chemistry of Solids
Abstract:Experimental evidences for the formation of amorphous-like Cu–C60 interface compounds were reported. Cu–C60 nano-composite films were prepared by co-deposition method. The mechanism for the electrical transport in the compound is the hopping conduction and the magnitude of the conductivity increases, while the activation energy decreases with the increasing of Cu ratio. There is a transition at about 260K in the curves of conductivity versus temperature, indicating that the transport mechanisms are related to the rotational order–disorder transition of C60 molecules.
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