Flexible Single-Component-Polymer Resistive Memory for Ultrafast and Highly Compatible Nonvolatile Memory Applications

Yongbian Kuang,Ru Huang,Yu Tang,Wei Ding,Lijie Zhang,Yangyuan Wang
DOI: https://doi.org/10.1109/led.2010.2048297
IF: 4.8157
2010-01-01
IEEE Electron Device Letters
Abstract:A novel flexible polymer resistive memory device based on single-component polymer polychloro-para-xylylene (parylene-C) sandwiched between Al or Cu top electrode and W bottom electrode is presented in this letter. With 4 × 4 crossbar array, the polymer memory device is fabricated by standard photolithograph technology, due to the chemical stability and the immunity of parylene-C to the chemicals and solvents in lithographic process. The device exhibits a good memory margin of more than 107 on/off current ratio, as well as ultrafast programming/erasing speed (<;15 ns). Moreover, a good retention time of more than 2.5 × 105 s and a cycling endurance of more than 130 program-read-erase-read cycles are obtained in this polymer memory device. The successfully demonstrated performance of this polymer memory shows great potential for transparent, flexible, and high-density memory applications and hybrid integration with CMOS back-end process.
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