Investigation on Thermal Conductivities of Plain-woven Carbon/Phenolic and Silica/Phenolic Composites at High Temperature: Theoretical Prediction and Experiment
Yifan Wang,Qiuyu Wang,Shuangyu Lv,Bowen Zuo,Lei Chen,Taofeng Cao,Chen,Wen-Quan Tao
DOI: https://doi.org/10.1016/j.compscitech.2024.110771
IF: 9.1
2024-01-01
Composites Science and Technology
Abstract:Phenolic resin-based ablation materials have found widespread applications in the aerospace industry. The prediction of their thermal conductivity is of paramount importance for the optimization and evaluation for thermal protection systems. However, there is rarely reported thermal conductivity performance of phenolic composites during ablation processes. Therefore, this investigation theoretically predicts the dynamic response of thermal conductivity at high temperatures for plain-woven carbon/phenolic and high silica/phenolic composites. By combining the progressive cubic ablation model with existing composite material property formulas, a multiscale prediction model for effective thermal conductivity is developed. The thermal performance of the resin matrix, reinforcing fibers, yarns, and overall fabric composites is calculated. Additionally, mesoscale representative volume elements are implemented to investigate the overall heat transfer characteristics of carbon/phenolic and high-silica/phenolic composites, including temperature and heat flux distributions. Moreover, both composites thermal conductivities are measured in the range from 298 K to 473 K. The proposed prediction model demonstrates good reliability, with average deviations of 3.76% and 7.36% compared to finite element analysis results and experimental data, respectively.