Compressive Behavior of Extruded SiCw/AZ91 at Temperatures Close to and above the Solidus of the Matrix Alloy

WM Gan,MY Zheng,SB Li,K Wu
DOI: https://doi.org/10.4028/www.scientific.net/msf.488-489.827
2005-01-01
Materials Science Forum
Abstract:Compressive deformation behaviors of extruded SiCw/AZ91 were investigated in Gleeble-1500 thermal simulator at temperatures from 743 K to 783 K and strain rates from 6.4×10-2 s-1 to 1.0×101s-1. Results showed that high strain rate sensitivity (~0.5) occurred during compression; deformation activation energy normalized by threshold stress was higher than the lattice self-diffusion activation energy of magnesium. Dynamic recovery (DRV) and dynamic recrystallization (DRX) took place during compression, which refined the grains. The increase of deformation energy was attributed to non-basal planes slip and climbing of dislocations and also the presence of liquid phase.
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