Microstructure and Wear Resistance of Cu/nano-SiC Composite

ZHU Jian-hua,LIU Lei,ZHAO Hai-jun,SHEN Bin,HU Wen-bin
DOI: https://doi.org/10.3969/j.issn.1000-3738.2006.10.013
2006-01-01
Abstract:In order to explorie a method of preparing particles reinforced metal matrix composites at room temperature, the composite electroforming technique was used to fabricate nano-sized carbide silicon particles (nano-SiC) reinforced copper composite. The surface morphology, microstructure, microhardness, wear resistance and electrical resistivity (Er) were investigated. The nano-SiC was embedded in copper matrix uniformly and tightly. The surface of composite was smooth, fine and compact The composite exhibited higher microhardness and better wear resistance than pure copper deposit, and the change range of Er was small
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