Simulation of Gate-All-Around Cylindrical Transistors for Sub-10 Nanometer Scaling

Xiao Deyuan,Xie Joseph,Chi Minhwa,Wang Xi,Yu Yuehui
DOI: https://doi.org/10.3321/j.issn:0253-4177.2008.03.010
2008-01-01
Abstract:A gate-all-around cylindrical (GAAC) transistor for sub-10nm scaling is proposed. The GAAC transistor device physics, TCAD simulation, and proposed fabrication procedure are reported for the first time. Among all other novel Fin- FET devices,the gate-all-around cylindrical device can be particularly applied for reducing the problems of the conven- tional multi-gate FinFET and improving the device performance and the scale down capability. According to our simula-tion,the gate-all-around cylindrical device shows many benefits over conventional multi-gate FinFET, including gate.all-around rectangular (GAAR) devices. With gate-all-around cylindrical architecture,the transistor is controlled by an essen-tially infinite number of gates surrounding the entire cylinder-shaped channel. The electrical integrity within the channel is improved by reducing the leakage current due to the non-symmetrical field accumulation such as the corner effect. The proposed fabrication procedures for devices having GAAC device architecture are also discussed. The method is character-ized by its simplicity and full compatibility with conventional planar CMOS technology.
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