Abstract:It is of particular interest in developing organic-inorganic composites based on polyimides (PIs) for improving the insulating, dielectric, and optical properties of flexible wiring boards. 1, 2 However, inorganic particles in micron-scale usually cause opaqueness and has not shown a strong demand for application as functional transparent composites. The hyperbranched polymers have received much attention in a variety of fields, because of the unique properties, such as low solution viscosity, high solubility, increasing free volume, as compared with their linear analogues. 1, 3, 4 Therefore, we synthesized a hydroxyl terminated hyperbranched polyimide 1, 2 as a component to satisfy the requirements for cutting-edge insulators with low dielectric constants and high thermal stability as well as to reduce inorganic particle sizes by controlling the interactions between polyimide backbone and silica phase for transparency. Then, based on the hydroxyl-terminated hyperbranched polyimide (HBPIBPADA-TAP(OH)), we successfully fabricated hybrid ternary composites which comprised of a linear polyimide (PI6FDA-APB), HBPIBPADA-TAP(OH), and inorganic SiO2 component by traditional ‘Sol-Gel’ method. It is complementary to improve the dielectric and thermal resistant drawbacks of unary systems and the dielectric and optical drawbacks of binary systems. 1, 2 For an optimized composition, the dielectric constant (Dk) of the PI6FDA-APB_HBPIBPADA-TAP(OH)-30%_SiO220% composite reaches the lowest value of 2.24 at 100 kHz. Moreover, the optical transparency is significantly improved with the increase of the HBPIBPADA-TAP(OH) content in the composite. Compared with the binary composite (PI 6FDA-APB_SiO2), the optical transmittance increases from 1 % to 75 % at the wavelength of 450 nm. Without the hyperbranched component, the aggregated silica particles can be clearly seen as spherical beads with smooth surface. By using the hyperbranched PI, the particle size of SiO2 is significantly reduced, from an average diameter around 1500 nm to 100-200 nm. The incorporation of SiO2 can preserve the good thermal properties of the hybrid composites containing HBPIBPADA-TAP(OH). By adding

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