Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy
N. A. M. Eid,A. M. Attia,A. A. Ibrahiem,A. E. Hammad
DOI: https://doi.org/10.1007/s10854-023-11620-2
2023-12-07
Journal of Materials Science Materials in Electronics
Abstract:A substantial advancement has been made in the prospective design strategy of composite alloys Sn–5Sb–0.3Cu (SSC503) containing multi-walled carbon nanotubes (MWCNT). These alloys may offer superior strength-ductility synergy compared to step soldering technology. The mechanical stability of the composites was measured using the pulse-echo overlap method. We employed Poisson's ratio and Pugh's ratio criteria to derive trends in the interatomic bonding character and brittleness vs. ductility. The results reveal a strong dependence of the elastic properties on the MWCNT reinforcement content, which in turn triggered the dendritic/cellular transition of β-Sn grains and inhibited the growth of the β-Sn, Sn 3 Sb 2 , β-SnSb, and Cu 6 Sn 5 phases. The ductility of the SSC503–0.1MWCNT composite was increased by ~ 29%, while a greater ionic contribution of interatomic bonding was achieved in all composites, even though the undercooling and pasty range were improved. Inclusion of 0.05 and 0.1 wt% MWCNTs into the SSC503 alloy decreased the pasty range from 7.9 to 5.9 and 6.6 °C, respectively. Moreover, the undercooling value shifted from 4.5 °C to a lower value of 3.3 and 3.9 °C. In addition, the mechanical properties were improved; the Young modulus and attenuating coefficient increased by 27.03 and 222.93% with 0.05 wt% MWCNTs, and with 0.1 wt% MWCNTs, by 20.76 and 141.98%, respectively. The improved properties arise due to different strengthening mechanisms involving interfaces, precipitation, and grain boundary area, which are the main contributions to the mechanical stability of these composites.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied