Changes in the circadian rhythmicity of N- and O-acetyltransferase activities in the pineal gland of 38 day old male Wistar rats when examined under white, red and green light

M. Balemans,I. Smith,G. F. D. Reuver

DOI: https://doi.org/10.1007/BF01253100

IF: 3.85

Journal of Neural Transmission

Abstract:

What problem does this paper attempt to address?

Electrical Property Improvement of Copper Filler Conductive Adhesive with Low-Melting Point Metal Bridge

Michiya Matsushima,Yusuke Takechi,Shogo Minami,Shinji Fukumoto,Kozo Fujimoto

DOI: https://doi.org/10.2320/matertrans.mh201810

2019-09-01

MATERIALS TRANSACTIONS

Abstract:Conductive adhesives are expected to be the solder alternative bonding materials in low temperature joining. However, the thermal resistivity and electrical resistivity are higher than those of solders. The contact resistances between the metal fillers and resin intrusion are considered to cause the high resistivity. To solve these problems, metallic cross-links are generated between the copper fillers in the conductive adhesives. Low melting point metal (SnBi) fillers which would be molten under curing temperature of the resin are mixed with copper fillers in the resin. In the curing process, the molten SnBi form the metallic bond cross-link between them. In this paper, the electrical resistivity as well as the thermal resistivity depending on the mixture ratio, size of fillers and the SnBi cross-link are investigated through the experiments.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Na Cheng,Zhi Sun,Xiaohui Yu,Qianzhen Yu,Jianwei Zhao

DOI: https://doi.org/10.1039/d3cp00209h

IF: 3.3

2023-01-01

Physical Chemistry Chemical Physics

Abstract:To impart conductivity and improve the shear performance of epoxy resin-based adhesives, a simple, environmentally friendly, and stable method was used to deposit silver on the surface of 5 μm flake copper particles as a conductive filler. The core-shell metal fillers were prepared by utilizing the autocatalytic properties of Cu without adding any reducing agent during the reaction. An epoxy curing agent (MeTHPA) was used as a curing agent for the crosslinking reaction with epoxy resin to form a supporting skeleton of conductive components. The structure of flake plated Cu@Ag particles was characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and energy dispersive spectroscopy (EDS). It was verified that a layer of compact and crystalline silver with a concave-convex characteristic was deposited on the surface of copper particles. This feature has a positive effect on improving the performance of silver-plated copper particles. The results show that the optimal curing condition of flake plated Cu@Ag particle-epoxy composite electrically conductive adhesives (ECAs) was 200 °C for 1 h, the resistivity of flake plated Cu@Ag particle-epoxy composite ECAs with a content of flake plated Cu@Ag particles above 55 wt% was less than 6 × 10-5 Ω m, and the maximum shear strength was 8 MPa. The flake plated Cu@Ag particle-epoxy composite ECAs prepared by this method have excellent properties and have very important application value for advanced electronic devices.
Effective fabrication of flexible nickel chains/acrylate composite pressure-sensitive adhesives with layered structure for tunable electromagnetic interference shielding

Chenhui Wang,Han Gao,Dongming Liang,Shuai Liu,Huijuan Zhang,Hongtao Guan,Yuxuan Wu,Yang Zhang

DOI: https://doi.org/10.1007/s42114-022-00482-7

IF: 11.806

2022-06-01

Advanced Composites and Hybrid Materials

Abstract:Functional adhesives with electromagnetic interference (EMI) shielding capabilities are urgently required to protect portable electronic products and wearable devices from unwanted microwave radiation. However, it is still a huge challenge to achieve the combination of strong adhesion, electrical conductivity, and superior EMI shielding characteristics for the adhesives. Herein, an EMI shielding functional and flexible adhesive is fabricated by incorporating nickel (Ni) chains into acrylate pressure-sensitive adhesive (a-PSA) via the solution casting technology. Correlations between the structure, adhesive properties, electrical behaviors, and electromagnetic characteristics are extensively investigated. The strong adhesive property and effective EMI shielding capability are achieved simultaneously via the unique spatial distribution of Ni chains. The adhesive failure mode changes from mixed failure to interfacial failure with the Ni chain content. The dielectric and electromagnetic properties are revealed with respect to electrical conductivity, complex permittivity, permeability, and relaxation behaviors. The electromagnetic characteristics are mainly controlled by the spatial distribution of Ni chains, which can be facilely modulated by the particle concentration. At the optimum content of Ni chains (30.0 wt.%), the composite adhesive exhibits a strong EMI shielding effectiveness (SE) of up to 39.97 dB with a thickness of 0.18 mm. At the same time, a sufficient peel strength of 39.56 N/m, shear strength of 41.07 kPa, and the static shear adhesion of 612.87 min under 16.33 kPa shear strength are achieved. An absorption-dominated shielding mechanism is demonstrated. Additionally, the composite adhesives can be easily attached onto various material surfaces by just light finger touch. The findings of this study improve the basic principles of adhesion with functional electromagnetic characteristics and provide a solid framework for the rational design of high-performance EMI shielding adhesives.Graphical abstractFlexible Ni chains/acrylate pressure-sensitive composite adhesives with excellent EMI shielding capabilities are elaborated via a scalable and versatile strategy.

nanoscience & nanotechnology,materials science, composites
Copper conductive adhesives for printed circuit interconnects

Siyuan Qi,Robert Litchfield,David A. Hutt,Bala Vaidhyanatharr,Changqing Liu,Patrick Webb,Stephen Ebbens,Bala Vaidhyanathan

DOI: https://doi.org/10.1109/ectc.2012.6249059

2012-05-01

Abstract:Isotropically conductive adhesives (ICAs) and inks are seen as suitable candidates for interconnecting components and for printed circuits. Silver (Ag) filled ICAs and inks are the most popular due to their high conductivity and good reliability. However, the price of Ag is a significant issue for the wider exploitation of these materials in low cost, high volume applications such as printed electronics. Copper (Cu) is considered as a more cost-effective filler with greater abundance. However, one of the major barriers to the implementation of Cu loaded ICAs is the poor oxidation resistance of Cu particles. The copper oxide is non-conducting and hence, the conductivity of untreated Cu loaded ICAs is limited. In this work, an efficient method for the removal of the copper oxide from copper powders and application of a protective organic coating to prevent re-oxidation was developed. The coating was found to be able to limit the reoxidation of the copper before mixing and curing of the adhesive. The treated copper powder was combined with an adhesive resin and tracks were stencil printed onto glass substrates, and cured by heating under an inert atmosphere. The effect of different adhesive resins was investigated and the samples were characterised for electrical performance and microstructure. Tracks with electrical conductivity comparable to Ag filled adhesives were obtained. The cured materials showed good stability of resistivity during storage under ambient conditions, but when exposed to 85°C and 85% relative humidity, the resistivity of exposed tracks increased substantially after 12 hours storage and methods to reduce this were identified. Functional circuits were fabricated by printing a pattern of Cu paste, placing surface mount components into the wet paste and curing.
Synthesis and Properties of Copper Conductive Adhesives Modified by SiO2 Nanoparticles

Hongsheng Zhao,Tongxiang Liang,Bing Liu

DOI: https://doi.org/10.1016/j.ijadhadh.2006.03.006

IF: 3.848

2006-01-01

International Journal of Adhesion and Adhesives

Abstract:Copper conductive adhesives were prepared and characterized with epoxy resin as the matrix, a mixture of m-phenylenediamine and diaminodiphenylm ethane as the hardener, and copper particles as the conducting filler. The influence of curing temperature, curing time, additive mass of curing agent, silane coupling agent (SCA), conductive solder and SiO2 nanoparticles on the properties of heat-curable conductive adhesive, such as curing, interconnect, adhesion strength, and electronic conductivity are researched. Results showed that copper powder was dispersed by SCA, preventing the agglomeration and improving the dispersion in matrix adhesive. It is indicated that SiO2 nanoparticles can disperse in the molecular chain of epoxy, which absorbs stress and energy, preventing the spreading of crack. The adhesion strength reached 20MPa and the bulk resistivity is lower than 1.34×10−3Ωcm when the adhesives cured at 80 and 145°C for 2h, respectively. The adhesion strength could increase to 25MPa when the SiO2 nanoparticles were doped.
Using Novel Materials to Enhance the Efficiency of Conductive Polymer

Cheng Yang,Matthew M. F. Yuen,Bing Xu

DOI: https://doi.org/10.1109/ectc.2008.4549972

2008-01-01

Abstract:Conductive polymers have a vast market in integrated circuits (IC) and microsystems packaging to enhance mechanical, thermal, electrical performance, and cost effectiveness[1]. Isotropically conductive adhesives (ICAs) have been explored for attaching encapsulated surface mount components on rigid and flexible printed circuits [2]. However, the practical use of conductive adhesives in surface mount applications is limited because of the weak electric conductivity. Jiang et al [3] used nano-sized silver particles as a candidate for conducting filers in order to reduce the sintering temperature, but the contact resistance is still high. Some groups [4, 5] studied a series of methods such as using carboxylic acid group containing chemicals as surfactants to enhance the conductivity of ICAs in a variety of conditions, but because the micron-sized silver fillers have a high sintering temperature, the enhancement in conductivity is still limited. In order to further improve the conductivity of ICAs and minimize the cost, we experimented on a series of materials for silver surface pretreatment. We noticed an about 20 times improvement in conductivity of the modified ICA than the control sample (75% silver content in all samples). The volume resistivity of the optimum formulation reached the level of 10-6 Omegaldrcm. We also analyzed the adhesion strength and thermal property of the modified ICA material. The study indicated that both the electrical properties and the mechanical property were improved without negatively affecting the other physical properties, and they are both remain stable after subjecting to the 85degC and 85% relative humidity conditioning test.
Synthesis and Curing of Hyperbranched Poly(Triazole)S with Click Polymerization for Improved Adhesion Strength

Youhong Tang,Cathy K. W. Jim,Yang Liu,Lin Ye,Anjun Qin,Jacky W. Y. Lam,Chengbi Zhao,Ben Zhong Tang

DOI: https://doi.org/10.1021/am9008727

IF: 9.5

2010-01-01

ACS Applied Materials & Interfaces

Abstract:We successfully synthesized hyperbranched poly(triazole)s by in situ click polymerization of diazides 1 and triyne 2 monomers on different metal surfaces (copper, iron, and aluminum) and characterized their adhesive properties. Optimizations were performed to obtain high adhesive strength at different temperatures by analyzing the effects of curing kinetics, annealing temperature and time, catalyst, monomer ratio, surface conditions, alkyl chain length of diazides 1, etc. The adhesive bonding strength with metal substrate is 2 orders of magnitude higher than similar hyperbranched poly(triazole)s made by click polymerization and clearly higher than some commercial adhesives at elevated temperatures. With the same conditions, adhesives prepared on aluminum and iron substrates have higher adhesive strength than those prepared on copper substrate, and an excess of triyne 2 monomer in synthesis has greater adhesive strength than an excess of diazide 1 monomer. Tof-SIMS experiment was employed to understand these phenomena, and the existence of an interphase between the polymer and metal surface was found to be critical for adhesive bonding with thicker interphase (excess of triyne 2 monomer) and the higher binding energy between polymer atoms and substrate atoms (e.g., aluminum substrate) generating the higher bonding strength. In addition, the light-emitting property of synthesized polymers under UV irradiation can be used to check the failure mode of adhesive bonding.
Acrylonitrile‐butadiene‐lignin thermoplastic rubber adhesive for enhanced metal‐to‐metal joining

Zeyang Yu,Nihal Kanbargi,Sumit Gupta,Yongsoon Shin,Yao Qiao,Christopher C. Bowland,Daniel R. Merkel,Kevin L. Simmons,Amit K. Naskar

DOI: https://doi.org/10.1002/pc.28258

IF: 5.2

2024-03-08

Polymer Composites

Abstract:Nano‐engineered lignin‐based thermoplastic adhesive exhibits improved adhesion performance. With the growing requirement for lightweight structural materials in automotive, aerospace, and infrastructure applications, multi‐material joints made with adhesive have attracted intense research interest. Commercial thermoset adhesives are one‐time cures, and difficult to disassemble the bonded components for repair and recycling. Our prior work with a thermoplastic acrylonitrile‐butadiene‐lignin rubber (ABL) addresses this sustainability/recycling challenge, but the adhesive exhibits deficient joining strength compared to standard thermosets. Here, we modify the ABL matrix by loading particulate fillers to enhance its modulus and toughness. The goal is to manufacture a cure‐free thermoplastic adhesive system with a simple dispensing protocol and characteristic ductility combined with a high yield stress for improved shear strength of a bonded joint. Fumed silica (FS) and epoxidized glass spheres (EGS) were used as fillers in the ABL to promote the dispersion of lignin particles that tailored the functionalities and free energy components of the adhesive surface. With optimal loading of FS (5 wt%) and EGS (30 wt%) in the ABL adhesive matrix, the lap‐shear strength of the bonded aluminum joint was elevated by 128%, compared to the neat ABL, reaching 21 MPa, which is 90% of the performance of a commercial epoxy‐based adhesive. Highlights A partly renewable filler‐toughened thermoplastic adhesive has been developed. This thermoplastic gives nearly equivalent performance of adhesively bonded aluminum joint compared to standard thermosets. Experimental and simulation data help understand the adhesive reinforcing mechanism by the fillers.

materials science, composites,polymer science
Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers

Enze Wang,Shunhua Wang,Fu Wang,Guangan Zhang,Lunlin Shang

DOI: https://doi.org/10.1088/1402-4896/ad4c9a

2024-05-18

Physica Scripta

Abstract:Magnetron sputtering is an alternative approach to prepare flexible copper clad laminates because of low cost and thin copper clad laminate thickness. However, Cu film has poor adhesion when directly deposited on polymer substrates, imposing certain limits to the use of magnetron sputtering technique. In this work, Cu film was deposited on polymer substrates including polyimide, polyethylene terephthalate and polytetrafluoroethylene. Different metal interlayers were introduced into the polymer/Cu interfaces to improve the adhesion between polymer substrates and Cu film. It was found that the metal interlayer could significantly improve the adhesion strength of Cu film to polymers and a reasonably rough polymer surface could also enhance the mechanical bonding with Cu film. A metal Ni interlayer provides the best adhesion enhancement, which is associated with the same crystal structure between Ni and Cu as well as their excellent solid solubility. Meanwhile, a metal interlayer also contributes to Cu (111) orientation growing during deposition. This proposes a promising route to overcome the wear adhesion problem between Cu film and polymers in the preparation of magnetron sputtered flexible copper clad laminates.

physics, multidisciplinary
Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Xiao Min Zhang,Xiao-Li Yang,Bin Wang

DOI: https://doi.org/10.1016/j.ijadhadh.2020.102785

IF: 3.848

2021-03-01

International Journal of Adhesion and Adhesives

Abstract:<p>In order to enhance the oxidation resistance of a copper substrate, silver films were deposited by three-times electroless plating onto pure copper powders. Silver-coated copper (Ag/Cu) powders were introduced into electrically conductive adhesives (ECAs) as conductive fillers. The electrical conductivity of the ECAs can be increased by the inclusion of conductive fillers into the insulating resin matrix. The structures of the Ag/Cu powders and ECAs were characterized by scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS), respectively. The morphology investigation showed that the silver coatings were compact and continuous. It was found that the ECAs can be solidified through chemical sintering in air at 150°C for 30min. The minimum volume resistivity was shown to reach<span class="math"><math>2×10-4Ω•cm</math></span>, suggesting excellent electrical conductivity, which makes us believe that the silver films have excellent oxidation resistance and could be broadly applied in the preparation of ECAs.</p>

materials science, multidisciplinary,engineering, chemical
Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder

Z. Sahebi Hamrah,V.A. Lashgari,M.H. Doost Mohammadi,D. Uner,M. Pourabdoli

DOI: https://doi.org/10.1016/j.microrel.2021.114400

IF: 1.6

2021-12-01

Microelectronics Reliability

Abstract:Electrically conductive adhesives were made using silver-coated copper powders (filler) and epoxy. Resistivity, microstructure and shear strength of prepared adhesives were studied using two-point resistance measurements, Scanning Electron Microscope (SEM) and universal tensile tests, respectively. Effect of filler concentration (70–85 wt%), silver concentration (10–50 wt%), particles morphology (flake or spherical) and addition of graphite (2–15 wt%) were investigated on prepared adhesives properties. Results showed that by increasing the filler percentage from 70 to 85 wt%, the electrical resistivity decreases from 6.2 × 10−3 to 3 × 10−3 Ω·cm. Furthermore, the electrical resistivity of adhesives is proportional to the silver content of the filler particles. Regarding the morphological effect of filler particles, it was found that by replacing 40 wt% of the flake with spherical particles in the adhesive with a filler content of 75 wt%, the electrical resistivity of the adhesive reduces from 5.6 × 10−3 to 4.5 × 10−3 Ω·cm, while the electrical resistivity of the adhesive containing 50 wt% of the spherical particles reached to 1.1 × 10−2 Ω·cm. Graphite addition to adhesive formula in concentrations less than 6 wt%, slightly lowered the resistivity of the adhesives. Increasing the graphite addition from 6 to 15 wt% enhanced the electrical resistivity from 2.8 × 10−3 to 1.7 × 10−2 Ω·cm. The shear strength of the adhesives is inversely proportional to the filler percentage in the adhesives.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
A Flexible and Electrically Conductive Liquid Metal Adhesive for Hybrid Electronic Integration

Tyler A. Pozarycki,Wuzhou Zu,Brittan T. Wilcox,Michael D. Bartlett

DOI: https://doi.org/10.1002/adfm.202313567

IF: 19

2024-01-20

Advanced Functional Materials

Abstract:This article introduces an electrically conductive adhesive with liquid metal and silver that is flexible, highly electrically conductive, robustly adhesive, and processable at low temperatures. This overcomes several challenges for component integration in hybrid electronic systems and provides a path forward for emerging applications in soft electronics, soft robotics, and multifunctional systems. Electrical and mechanical integration approaches are essential for emerging hybrid electronics that must robustly bond rigid electrical components with flexible circuits and substrates. However, flexible polymeric substrates and circuits cannot withstand the high temperatures used in traditional electronic processing. This constraint requires new strategies to create flexible materials that simultaneously achieve high electrical conductivity, strong adhesion, and processibility at low temperature. Here, an electrically conductive adhesive is introduced that is flexible, electrically conductive (up to 3.25×105 S m−1) without sintering or high temperature post‐processing, and strongly adhesive to various materials common to flexible and stretchable circuits (fracture energy 350

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Microstructure Regulation and Fabrication of Epoxy-based Conductive Films with Excellent Electrical and Thermal Conductivity, Adhesion, Toughness, and Flexibility

Hongming Yang,Li Zhang,Rong Chen,Shaoyun Guo

DOI: https://doi.org/10.1016/j.polymertesting.2024.108657

IF: 5.1

2024-12-06

Polymer Testing

Abstract:The electrically conductive adhesive films (ECAFs) are new materials used for large-format bonding in microelectronics packaging. However, improving its electrical and thermal conductivity, adhesion, and flexibility simultaneously has been a challenge. In this study, silver powder with different particle sizes and poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) (PEDOT/PSS) were used to create a high-efficient multi-scale conductive bridge structure. This reduced the volume resistivity from 7.30×10 -4 Ω·cm to 3.80×10 -4 Ω·cm, with lower silver powder content. The thermal conductivity improved from 9.074 W/m·K to 9.124 W/m·K, and adhesion performance between the epoxy matrix and the metal increased from 6.85 MPa to 8.08 MPa. Furthermore, the addition of hydroxyl-functionalized polyurethane materials enhanced the toughness without significantly affecting its electrical, thermal, and adhesion properties. This study successfully prepared epoxy-based conductive adhesive films with a combination of electrical conductivity, thermal conductivity, adhesion, and flexibility, while significantly reducing costs due to the reduction in silver powder content.

materials science, characterization & testing,polymer science
Copper Particles/epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin As Curing Agent

Zhi-Min Dang,Bo Zhang,Jinge Li,Jun-Wei Zha,Guo-Hua Hu

DOI: https://doi.org/10.1002/app.36951

IF: 3

2012-01-01

Journal of Applied Polymer Science

Abstract:Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60 degrees C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 O cm. The variation of bulk resistivity was less than 15% at high temperature (100 degrees C). (c) 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012
Robust and Reversible Thermal/Electro‐Responsive Supramolecular Polymeric Adhesives via Synergistic Hydrogen‐Bonds and Ionic Junctions

Qizhe Deng,Shengli Han,Yanggui Wu,Yiwen Chen,Yinhua Zhang,Yonggang Zhao,Senbin Chen,Jintao Zhu

DOI: https://doi.org/10.1002/anie.202415386

2024-10-26

Angewandte Chemie International Edition

Abstract:Adhesive conducting elastomers are rising materials towards cutting-edge applications in wearable and implantable soft electronics. Yet, engineering the conductive adhesives with robust and tunable interfacial bonding strength is still in its infancy stage. We herein identify a structurally novel supramolecular polymer scaffold, characterized by synergistic coexistence of hydrogen-bonding (H-bonding) interactions and electrostatic ionic junctions, endowing the robust and tunable elastic conducting adhesives with remarkable thermal/electro-responsive performance. H-bonding association and electrostatic interaction play orthogonal yet synergistic roles in the strong supramolecular adhesive formation, serving as the leveraging forces for opposing both cohesion and adhesion energy. To do so, six-arm star-shaped random copolymers P(DAP-co-Thy-co-MBT)6 are strategically designed, bearing H-bonding PDAP (poly(diaminopyridine acrylamide)) and PThy (poly(thymine)) segments, which can form hetero-complementary DAP/Thy H-bonding association, along with conductive poly(ionic liquid)s segment: PMBT, (poly(1-[2-methacryloylethyl]-3-methylimidazolium bis(trifluoromethane)-sulfonamide)). DAP/Thy H-bonding association, along with electrostatic ionic interaction, can yield dual supramolecular forces crosslinked polymeric networks with robust cohesion energy. Moreover, coexistence of poly(ionic liquid)s can impact and interfere the configuration of H-bonding association, liberate more free DAP and Thy motifs to form H-bonds towards substrate, affording strong surface adhesion in a synergistic manner. This work demonstrates a significant forward step towards potential adhesives devoted to hybrid electronic devices.

chemistry, multidisciplinary
Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

chaowei li,xike gong,lei tang,kai zhang,jie luo,lin ling,jun pu,taotao li,mingxing li,yagang yao

DOI: https://doi.org/10.1039/c5tc00593k

IF: 6.4

2015-01-01

Journal of Materials Chemistry C

Abstract:One of the largest obstacles for Ag based electrically conductive adhesives (ECAs), as an alternative for Pb-containing solders in electronic packaging, is that the conductivity of ECAs is lower than that of solders due to the limited physical contact area between/among conductive fillers and the insulated organic lubricant and metal oxide layers on the surface of the conductive fillers. What's more, the high cost of Ag fillers is also restricting the wide use of Ag based ECAs. In this study, Ag-coated-Cu flakes were chosen as a substitute for Ag flakes to reduce the cost. At the same time, the coating of Cu with an Ag layer could protect the Cu-based fillers from oxidation and corrosion. A mixture of weak reducing agents and substituting agents was selected to treat the Ag-coated-Cu flakes to increase the conductivity of the Ag-coated-Cu based ECAs. During the treatment process, the weak reducing agents can reduce the metal oxides on the filler surfaces, enabling more metallic contacts. Meanwhile, the substituting agents can partially remove or replace the long chain fatty acid lubricants on the metal flakes, improving the electron tunneling between/among neighboring flakes. As such, the multiple effects of the reducing agents and substituting agents can improve the conductivity of the ECAs. By using an appropriate amount of terephthalaldehyde and iodine treated Ag-coated-Cu flakes, the resistivity was reduced to as low as 1.28 x 10(-4) Omega cm for the ECA with 75 wt% content of treated fillers, which is comparable to that of commercially available Ag-filled ECAs (x10(-4) Omega cm). This work suggests that a surface chemical method can enhance the electrical conductivity of metal filler based ECAs.
The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

Qiong Fan,Huiwang Cui,Chune Fu,Dongsheng Li,Xin Tang,Zhichao Yuan,Lilei Ye,Johan Liu

DOI: https://doi.org/10.1149/1.3567678

2011-03-21

ECS Transactions

Abstract:This research used low molecular surface modifiers, and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Several different functionalizers, such as thioglycolic acid, silane and di-acid, were used to functionalize the silver surface. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. The adipic acid had the greatest effect on the rheological and electrical property of ICAs, so its weight percentage in silver flakes was also optimized; ICAs displayed the maximum electrical conductivity when there was 0.5 wt% of silver flakes.
Amino acid-modified polysiloxane for superior metal bonding and antimicrobial coatings

Ruilu Guo,Wenning Qi,Dongxu Li,Guangxin Chen,Qifang Li,Zheng Zhou

DOI: https://doi.org/10.1016/j.porgcoat.2023.107720

IF: 6.6

2023-06-09

Progress in Organic Coatings

Abstract:The development of high-bond strength polysiloxane adhesives has faced challenges due to limitations in adhesive strength and cohesion. To address this issue, the present study introduced a biobased N -acetyl-L-cysteine (NACL) modified polysiloxane adhesive with antimicrobial properties. This adhesive exhibited enhanced bonding strength through the formation of a substantial number of hydrogen bonds . The carboxyl group in NACL underwent an acid-base neutralization reaction with sodium ethoxide, resulting in the formation of ionic aggregates. These aggregates, along with hydrogen bonding, enhanced the mechanical properties of polysiloxane, leading to a further improvement in bond strength. At ambient temperature, the modified polysiloxane adhesive displayed remarkable lap shear and peel strengths, with maximum values of 8.16 MPa and 20.48 N/m for metallic iron, 3.56 MPa and 14.99 N/m for metallic aluminum, and 5.55 MPa and 20.52 N/m for metallic copper. Furthermore, the inclusion of NACL in the polysiloxane adhesive demonstrated pronounced inhibition against Staphylococcus aureus . As such, this high-performance polysiloxane adhesive has significant potential for use in the metallic bonding of medical devices, adhesive coating of metallic surfaces, and skin adhesion coating.

materials science, coatings & films,chemistry, applied
A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Shuye Zhang,Xiaoquan Qi,Ming Yang,Yang Cao,Tiesong Lin,Peng He,Kyung-Wook Paik

DOI: https://doi.org/10.1007/s10854-019-01246-8

2019-04-06

Abstract:Electrically conductive adhesives (ECAs) are mainly used in IC packaging, LED packaging and other electronic industry to replace the traditional soldering and lead-free solders, therefore, there is a constant need to improve the electrical conductive and mechanical property of ECAs. In this study, the electrical resistivity and shear strength of the modified nano-Ag coated Cu particles in ECA was investigated and compromised, in terms of filler contents, curing temperature and curing time. The conductive mechanism of the modified nano-Ag coated Cu particles in ECA was discussed as the filler content increased. Finally, the filler content was optimized by 23.5 vol% and 170 °C 100 min curing condition was selected to obtain the compromised property (5.159 × 10−6 Ω cm 6.121 MPa), which is better than the previous one (4.99 × 10−6 Ω cm, 4.406 MPa) at 200 °C. The tested data, as well as the failure mode and fracture interfaces, were carried out in this study.
Fabrication of PS-DVB@Cu core-shell microsphere for anisotropic conductive adhesives by electroless plating with copper nanoparticles as seeds

Yuling Shi,Qing Liu,Qianqian Pan,Danlong Yang,Tao Wang

DOI: https://doi.org/10.1016/j.colsurfa.2023.133037

IF: 5.518

2023-12-30

Colloids and Surfaces A Physicochemical and Engineering Aspects

Abstract:Polymer@metal core-shell microspheres are widely used in anisotropic conductive adhesives (ACAs). Styrene-divinylbenzene copolymer (PS-DVB) copper core-shell microspheres (PS-DVB@Cu) with high conductivity and anti-oxidation performance were successfully prepared by combining copper nanoparticles (Cu NPs) and electroless plating copper. The Cu NPs served as catalytic seeds, substituting noble metals to promote electroless deposition. Using environmentally benign ammonia borane as the reductant to replace toxic formaldehyde, the dense copper film was deposited on the surface of PS-DVB microspheres. The thickness of the Cu layer and bulk electrical resistivity of PS-DVB@Cu were tuned by controlling the concentration of the reducing agent. The minimum resistivity of PS-DVB@Cu was 3.27 × 10 −6 Ω·m and merely slightly changed in the air for two months. The prepared PS-DVB@Cu-based ACAs could be effectively applied to anisotropic conductive connections in small-scale circuits with satisfactory anisotropic conductivity.

chemistry, physical

Changes in the circadian rhythmicity of N- and O-acetyltransferase activities in the pineal gland of 38 day old male Wistar rats when examined under white, red and green light

Electrical Property Improvement of Copper Filler Conductive Adhesive with Low-Melting Point Metal Bridge

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Effective fabrication of flexible nickel chains/acrylate composite pressure-sensitive adhesives with layered structure for tunable electromagnetic interference shielding

Copper conductive adhesives for printed circuit interconnects

Synthesis and Properties of Copper Conductive Adhesives Modified by SiO2 Nanoparticles

Using Novel Materials to Enhance the Efficiency of Conductive Polymer

Synthesis and Curing of Hyperbranched Poly(Triazole)S with Click Polymerization for Improved Adhesion Strength

Acrylonitrile‐butadiene‐lignin thermoplastic rubber adhesive for enhanced metal‐to‐metal joining

Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder

A Flexible and Electrically Conductive Liquid Metal Adhesive for Hybrid Electronic Integration

Microstructure Regulation and Fabrication of Epoxy-based Conductive Films with Excellent Electrical and Thermal Conductivity, Adhesion, Toughness, and Flexibility

Copper Particles/epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin As Curing Agent

Robust and Reversible Thermal/Electro‐Responsive Supramolecular Polymeric Adhesives via Synergistic Hydrogen‐Bonds and Ionic Junctions

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

Amino acid-modified polysiloxane for superior metal bonding and antimicrobial coatings

A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Fabrication of PS-DVB@Cu core-shell microsphere for anisotropic conductive adhesives by electroless plating with copper nanoparticles as seeds