Super-thick highly thermally conductive graphite/Sn laminated composites assembled by active Ti-containing Sn-Ag-Ti filler metals
Weibing Guo,Yiren Hu,Xiaoguang Chen,Ye Yuan,Haitao Xue,Anhang Li,Chong Fan
DOI: https://doi.org/10.1016/j.diamond.2023.110253
IF: 3.806
2023-07-31
Diamond and Related Materials
Abstract:The development of highly performance thermal management material becomes critical in recent years due to the high integration of electronic products. In order to prolong the thickness of graphite materials, we propose a new process to fabricate thick graphite/Sn laminated composites based on brazing technology. The active filler metal was added to form solid combination between thin highly thermally conductive graphite films. The achieved laminated composites have maximum thickness of 4.375 mm and maximum thermal conductivity of 983 W/m·K. Furthermore, the thicker laminated composites could be obtained by using this method as well. The composites are proved to possess high heat flux during process of heat transfer, and the transfer rate was almost twice that of traditional thermal conductivity metal such as Cu and Al. Copper used 74 s to raise 15 °C, while 60-layer composites only took 37 s in the same level under equivalent experimental condition. The maximum 64.21 MPa tensile strength was obtained. The elongation gradually rises with the growth thickness of the composites. 18.9 % elongation was achieved with 20-layer composites. With the controllable thickness and reliable mechanical properties, the composites are able to be a solution for heat dissipation of integrated appliances.
materials science, multidisciplinary,physics, applied, condensed matter, coatings & films