Determination of Tin,Copper,Lean in Electroplating Solution by Selective Chelatometry

WANG Xian-ke,LI Yu-ping
DOI: https://doi.org/10.3969/j.issn.1671-9905.2006.10.009
2006-01-01
Abstract:One rapid chelatometry for the determination of Sn,Cu an Pb in the electroplating solution was introduced.After the clelation with Sn(Ⅳ),Cu(Ⅱ),Pb(Ⅱ) and other metal ions,EDTA solution was demaskinged with trihydroxybenzoic acid,mercaptosuccinic acid and dithiocarbamic propanoic acid respectively.The liberated EDTA was titrated with Zn(Ⅱ) standard solution applied xylenol orangeCPB as mixed indicator.The influence of coexistence ions was studied.This method had been used for the determination of Sn,Cu,Pb in Sn-Cu-Pb alloy plating solution and alloy coating.
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