Crystal Growth and Oxygen Precipitation Behavior of 300 Mm Nitrogen-Doped Czochralski Silicon

Daxi Tian,Deren Yang,Xiangyang Ma,Liben Li,Duanlin Que
DOI: https://doi.org/10.1016/j.jcrysgro.2006.04.015
IF: 1.8
2006-01-01
Journal of Crystal Growth
Abstract:A 300mm, p-type, 〈100〉-oriented nitrogen-doped Czochralski (NCZ) silicon crystal was grown in a Keyex MCZ 150 crystal puller equipped with cusp magnetic field. In order to dope nitrogen into the crystal, the primary protection gas of argon was mixed with high-purity nitrogen gas at a flow rate ratio of 10:1. Due to the long time growth of crystal, any perturbation due to the SiO and cristobalite particles at the crystal/melt interface would generate dislocation in the crystal. In order to avoid this ‘disaster’ during the crystal growth, a thermal shield in connection with a protection gas director was used, thereby generating a sweeping flow over the melt to drive the SiO and cristobalite particles out of the crystal/melt interface. The oxygen precipitation behavior of a near-seed-end wafer subjected to 800°C/8h+1000°C/16h was investigated. It was found that oxygen precipitation within the P-band was stronger than that in the region outside of the P-band, which is generally not the case for the conventional Czochralski (CZ) wafer with P-band. Based on this result, it is deduced that the grown-in oxygen precipitates existing in the P-band are relatively smaller in size but with higher density compared to those in the CZ crystal.
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