Abstract:In large area micro hot embossing, the process temperature plays a critical role to both the local fidelity of microstructure formation and global uniformity. The significance of low temperature hot embossing is to improve global flatness of embossed devices. This paper reports on experimental studies of polymer deformation and relaxation in micro embossing when the process temperatures are below or near its glass transition temperature (Tg). In this investigation, an indentation system and a micro embosser were used to investigate the relationship of microstructure formation versus process temperature and load pressure. The depth of indentation was controlled and the load force at a certain indentation depth was measured. Experiments were carried out using 1 mm thick PMMA films with the process temperature ranging from Tg-55 degrees C to Tg +20 degrees C. The embossed structures included a single micro cavity and groups of micro cavity arrays. It was found that at temperature of Tg-55 degrees C, elastic deformation dominated the formation of microstructures and significant relaxation happened after embossing. From Tg-20 degrees C to Tg, plastic deformation dominated polymer deformation, and permanent cavities could be formed on PMMA substrates without obvious relaxation. However, the formation of protrusive structures as micro pillars was not complete since there was little polymer flow. With an increase in process temperature, microstructure could be formed under lower loading pressure. Considering the fidelity of a single microstructure and global flatness of embossed substrates, micro hot embossing at a low process temperature, but with good fidelity, should be preferred.

INVESTIGATION ON SEVERAL CRUCIAL FACTORS INFLUENCING THE HOT-EMBOSSING LITHOGRAPHY WITH TiN MOLD

Optimization of Control Parameters in Micro Hot Embossing

Flow Behavior of Polymer During Micro Hot Embossing

Research on Optimization of the Hot Embossing Process

Simulation Research on Stress of Polymeric Patterns During Micro Hot Embossing

Defects in Micro Hot Embossing Process

Study on Polymer Flow Profile in Micro Hot Embossing

Research on Modeling of Hot Embossing Polymeric Microfluidic Chip

Impact of process parameters on the flow behavior and filling accuracy of photoresist in hot embossing for microgroove array

Analysis of Pattern Height Development in Hot Embossing Process

Experimental Study on the Hot Embossing Polymer Microfluidic Chip

Study of Hot Embossing Using Nickel and Ni–PTFE LIGA Mold Inserts

Research on Heat Transfer for Hot Embossing of Polymeric Microfluidic Chips

Finite Element Modeling of Polymer Flow During Hot Embossing with Different Mold Structures and Embossing Conditions

Analysis of the Demolding Forces During Hot Embossing

Enhanced Polymer Filling and Uniform Shrinkage of Polymer and Mold in A Hot Embossing Process

Study of the Demolding Process - Implications for Thermal Stress, Adhesion and Friction Control

Numerical Analysis of Impact of Imprinting Pressure on Profile Shape and Mold Deformation in UV-NIL

Experimental Study on the Fabrication of the Light Guide Plate with Hot Embossing Method

Studies of Polymer Deformation and Recovery in Hot Embossing

A Research on Stress and Demolding Temperature During Hot Embossing Process of Microlens Array