Abstract:In large area micro hot embossing, the process temperature plays a critical role to both the local fidelity of microstructure formation and global uniformity. The significance of low temperature hot embossing is to improve global flatness of embossed devices. This paper reports on experimental studies of polymer deformation and relaxation in micro embossing when the process temperatures are below or near its glass transition temperature (Tg). In this investigation, an indentation system and a micro embosser were used to investigate the relationship of microstructure formation versus process temperature and load pressure. The depth of indentation was controlled and the load force at a certain indentation depth was measured. Experiments were carried out using 1 mm thick PMMA films with the process temperature ranging from Tg-55 degrees C to Tg +20 degrees C. The embossed structures included a single micro cavity and groups of micro cavity arrays. It was found that at temperature of Tg-55 degrees C, elastic deformation dominated the formation of microstructures and significant relaxation happened after embossing. From Tg-20 degrees C to Tg, plastic deformation dominated polymer deformation, and permanent cavities could be formed on PMMA substrates without obvious relaxation. However, the formation of protrusive structures as micro pillars was not complete since there was little polymer flow. With an increase in process temperature, microstructure could be formed under lower loading pressure. Considering the fidelity of a single microstructure and global flatness of embossed substrates, micro hot embossing at a low process temperature, but with good fidelity, should be preferred.

Finite Element Modeling of Polymer Flow During Hot Embossing with Different Mold Structures and Embossing Conditions

Flow Behavior of Polymer During Micro Hot Embossing

Study on Polymer Flow Profile in Micro Hot Embossing

Simulation Research on Stress of Polymeric Patterns During Micro Hot Embossing

Research on Optimization of the Hot Embossing Process

Research on Modeling of Hot Embossing Polymeric Microfluidic Chip

Numerical simulation of filling flow of polymer melt in injection molding

Optimization of Control Parameters in Micro Hot Embossing

Enhanced Polymer Filling and Uniform Shrinkage of Polymer and Mold in A Hot Embossing Process

Numerical Simulation of Mold Filling of Polymeric Materials with Friction Effect during Hot Embossing Process at Micro Scale

Defects in Micro Hot Embossing Process

Analysis of Pattern Height Development in Hot Embossing Process

Experimental Study on the Hot Embossing Polymer Microfluidic Chip

Impact of process parameters on the flow behavior and filling accuracy of photoresist in hot embossing for microgroove array

Research on Heat Transfer for Hot Embossing of Polymeric Microfluidic Chips

Effect of process parameters on filling behavior of PMMA in hot embossing

In-situ observation on the real-time filling deformation of PMMA into microchannel during hot embossing

Studies of Polymer Deformation and Recovery in Hot Embossing

The polymer melt swelling behavior in micro-extrusion process for preparation of continuous carbon fiber reinforced PP prepreg filament

Impact on Fluid Flow State by Different Structural Parameters of Immersion Lithography Unit

Investigation of hot roller embossing for microfluidic devices