Optimization of delmination of R-FPC by using plasma treatment

DONG Ying-tao,HE Wei,CHEN Yuan-ming,YUAN Peng-fei,FAN Hai-xia,HUANG Yong,SU Xin-hong,CHEN Zheng-qing
DOI: https://doi.org/10.3969/j.issn.1009-0096.2013.z1.054
2013-01-01
Abstract:Orthogonal experiment was designed to optimize the plasma treating parameters of polyimide cover film to prevent the delamination in rigid-flex PCB manufacturing processes. The relationship between surface roughness and wetting angle of polyimide cover film was analyzed. The effects of hot press were also investigated through strain relief test and thermal stress test. The results showed that linear correlation was found in the relationship between surface roughness and wetting angle of polyimide cover film, polyimide cover film treated under the optimized plasma parameters [Gas ratio(CF4:O2) 0.1, Power 11kW, Time 10min, Flow 1500ml/min] had good agreement in binding force with the increase of 0.88N and delamination was avoided after thermal stress test. The approach of plasma treating to polyimide cover film could effectively solve the problem of Rigid-flex delamination.
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