A Method for Testing Thermal Conductivity of Multi-layer Films

ZHU Jie,WU Zhi-ming,YANG Li-xia,YUAN Kai,JIANG Ya-dong
DOI: https://doi.org/10.3969/j.issn.1672-8785.2010.12.004
2010-01-01
Abstract:A new structure for testing the thermal conductivity of multi-layer films is presented.The structure is simulated by using ANSYS,a finite element software.The influences of heating power,the length and width of cantilevers and other factors on the temperature distribution of the structure are analyzed.Since the simulation result is in agreement with the theoretical value,the feasibility of this method is verified.The thermal conductivity of multi-layer films with a micro-bridge structure is one of the key parameters affecting the performance of the device.The method need not to be implemented in vacuum and has the features of simple structure and easy operation.
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