Miniature Surface Acoustic Wave Duplexer Using SiO2/Al/LiNbO3 Structure for Wide-Band Code-Division Multiple-Access System

Hiroyuki Nakamura,Hidekazu Nakanishi,Tetsuya Tsurunari,Ken Matsunami,Yukio Iwasaki,Ken-ya Hashimoto,Masatsune Yamaguchi
DOI: https://doi.org/10.1143/jjap.47.4052
IF: 1.5
2008-01-01
Japanese Journal of Applied Physics
Abstract:In this paper. we describe the development of a miniature surface acoustic wave (SAW) duplexer for Band I in the standard of the Third-Generation Partnership Project (3GPP) at a 2 GHz band. We employed a shear-horizontal SAW on a SiO2 overlay/thick Al elcctrode/5 degrees YX-LiNbO3 Structure. which offers a high electromechanical coupling coefficient (K-2) as well as a small temperature coefficient of frequency (TCF). This feature is crucial for the realization of a wide duplex gap between the transmitting and receiving, bands in the Band I specification. We investigated experimentally that the Spurious response Caused by the Rayleigh-mode could effectively be suppressed by controlling the cross-sectional shape of a SiO2 overlay on interdigital transducer (IDT) electrodes. In addition. the result also showed how this spurious response depends on IDT design parameters. i.e., electrode pitch and metallization ratio. The developed SAW duplexer was installed in a 2.5 x 2.0 mm(2) package, and exhibited a low insertion loss. a high out-of-band rejection and a small TCF. [DOI: 10.1143/JJAP.47.4052]
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