Analysis of SAW Resonator on SiO 2 / Al / LiNbO 3 Structure by using FEM / SDA FEM / SDA SiO 2 / Al / LiNbO 3 SAW

Hiroyuki Nakamura,Hidekazu Nakanishi,Rei Goto,Ken-ya Hashimoto,Masatsune Yamaguchi
2009-01-01
Abstract:Velocity of slow shear wave h SiO2 Because of their low insertion loss, high out-of-band rejection and high power durability, miniature surface acoustic wave (SAW) duplexers are widely used in mobile phones based on the universal mobile telecommunication system (UMTS). Substrate materials mainly limit and determine the performance of SAW duplexers; for their application to Band I with large pass-band widths and wide frequency separation between the Tx and Rx bands, a larger coupling coefficient K is of primary importance. For one of the large K solutions, a SAW filter on a Cu/LiNbO3 structure was discussed . In spite of its large K, however, a LiNbO3 substrate has poor TCF. Although SiO2 film / thin Al electrode and flat SiO2 film / Cu electrode / LiNbO3 substrate structures were reported for improved TCF, we have experimentally developed a shape controlled SiO2 film/Al electrode / LiNbO3 substrate structure for Band I duplexer. This is because the structure possesses large K with improved TCF and is effective in the suppression of Rayleigh-mode spurious responses. In this paper, we report the analysis of a SAW resonator on the SiO2 film / Al electrode / LiNbO3 structure by using FEM/SDA. Fig. 1 K and va as a function of h on a flat SiO2/Al/LiNbO3 structure.
What problem does this paper attempt to address?