Property of Joint Resistance of Bi2223 Multi-filamentary Tape by Using Sn-Pb Solder

C. Gu,C. Zhuang,J.Y. Zhang,T.M. Qu,Z. Han

DOI: https://doi.org/10.1016/b978-008044559-5/50118-6

2005-01-01

Abstract:In this paper, the joint resistance between two Bi2223 multi-filamentary tapes was measured by field decay method. In order to achieve this goal, a closed Bi2223 coil was fabricated. The joint was welded with ordinary Sn-Pb solder. The field decay measurement at the center of the coil was carried out at 77K. Most of results followed the curve predicted by the classical R-L circuit. The result is compared with data from commonly used 4-probe method. An equivalent circuit model was also proposed by which the joint resistance could be quickly approximated.