Preparation and Property Study of Low Exothermic Room Temperature Curing Epoxy Adhesive

ZHONG Zhen,REN Tian-bin,HUANG Chao
2011-01-01
Abstract:Low exothermic room temperature curing epoxy adhesive was prepared by adding mercaptoacetic acid to mercaptan terminated liquid curing agent system.The influence of E-44,E-51 and Al(OH3 contents on the viscosity of part-A was studied and the properties of adhesive with different accelerators were tested.The effect of DMP-30 contents on thermal properties of adhesive was investigated and the water resistance of adhesive with different amount of mercaptoacetic acid were discussed.The results showed that the heat distortion temperature of the system with 10% DMP-30 was the maximum.The water resistance of adhesive was increased greatly by adding mercaptoacetic acid.The exothermic peak temperature,gel time and tensile strength of the epoxy adhesive with 2% mercaptoacetic acid were 80.1 ℃,27-30 mintues and 24.2 MPa,respectively.
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