Researches on dynamic mechanical properties of room-temperature cured epoxy adhesive

LI Hui,LUO Ying-she,XIE Jian-jun,CHEN Sheng-ming
DOI: https://doi.org/10.3969/j.issn.1673-923X.2012.05.037
2012-01-01
Abstract:The epoxy resin adhesive curing behaviours with different dosage of amine curing agent were compared and analyzed.The experimental results show that there were two groups of sample which completely cured at room temperature,and they had higher modulus and small internal friction than others.The temperature scanning test shows that the vitrification transition temperatures cross-linking degree and of epoxy resin adhesive raised as the curing agent dosage increased,and the activation energy for the curing process also increased.The testing results of frequency scan indicate that the two groups of samples' tan δ changing curves were approximately same under 50℃,and so the figures of tan(δ) under different temperatures can be obtained by moving the curves of tan δ up and down.
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