Application Study on Deformation Measurement in Mid-Temperature Environment for SnSb8.5 Welding Wire Using DSCM

ZHANG Jun-hui,FENG Ping,CAI Zeng-shen,LIANG Li-hua
DOI: https://doi.org/10.3969/j.issn.1006-4303.2006.05.024
2006-01-01
Abstract:The mechanical properties performance of SnSb8.5 welding wire which is a kind of Pb-free material has been studied.Because its deformation is big and is tested in mid-temperature environment,normal extensometer isn't suit to test it.For these,we discussed a method called Digital Speckle Correlation Method of non-contact strain measurement.DSCM has its own advantages of full-field,high-accuracy and easy-operate.We apply DSCM to strain test of SnSb8.5 Pb-free solder wire in mid-temperature environment.The method is proved to be reliable by experiment first.Then,we apply DSCM to testing mechanical property of SnSb8.5 solder wire in mid-temperature environment.Finally, we get the stress and strain data successfully that will offer theory basis for wide application of Pb-free material.
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