Abstract:The combined effects of thermomigration (TM) and electromigration (EM) were investigated in Cu/Sn3.0Ag0.5Cu/Ni solder joints by applying a 5×103A/cm2 DC current to the joints. With a thermal gradient, the Cu atoms and Ni atoms were found to migrate towards the lower temperature side while the Sn atoms were found to migrate towards the higher temperature side. For the solder joint stressed with a 5×103A/cm2 DC current, TM was found to play a dominant effect on the migration of Cu atoms in the solder because the Cu atomic flux in the solder which was induced by EM was smaller than that was induced by TM. The Ni atomic flux in the solder that was induced by TM was smaller than that induced by EM, but it could not be ignored because the values were the same order of magnitude. The Sn atomic flux induced by TM could be ignored due to its smaller magnitude than that induced by EM. The Cu3Sn IMC layer and Cu6Sn5 IMC layer at the Cu/solder interface in the joint with Cu as the anode were thicker than corresponding layers at the Cu/solder interface in the joint with Cu as the cathode. The IMC at the Ni/solder interface of joint with Cu as the anode was the Ni3Sn4 phase while that in the solder joint with Cu as the anode was the (Cu,Ni)6Sn5, and the former was thicker than the latter. EM and TM induced dissolution of the Ni3Sn4 IMC into the solder was found to be the main cause of the formation of voids at the Ni3Sn4/solder interface from a joint that used Cu as the anode. For the solder joint that used Cu as the anode, the Ni3Sn4 IMC layer at the Ni/solder interface was as thick as the Cu-Sn IMC layer at the Cu/solder interface. By contrast, for the solder joint that used Cu as the cathode, the IMC layer at the Ni/solder interface was thinner than that at the Cu/solder interf- - ace.

In Situ Measurement of Stress Evolution in Sn-based Solder Joint under Electromigration Based on X-ray Diffraction Technique

Investigation of Stress Evolution at the Interface of Cu/Sn3.0Ag0.5Cu/Cu Solder Joint during Electromigration

Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Electromigration in Cu-Cored Sn-3.5Ag-0.7Cu Solder Interconnects under Current Stressing

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

Electromigration and Thermomigration in Sn3Ag0.5Cu Solder Joints

Numerical Simulation of the Atomic Migration and Diffusion During Current Stressing in the Cu/Sn-58bi/Cu Solder Joints

An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints

In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint

Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition

Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction

The Effect Of Cu Orientation On Fracture Location In Cu3sn-Cu Interface Structure Under Monotonic Loading Condition By Molecular Dynamics Simulation

Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer

In-situ study of creep in Sn-3Ag-0.5Cu solder

Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling

Effect of intermetallic on electromigration and atomic diffusion in Cu/SnAg 3.0Cu 0.5/Cu joints: Experimental and first-principles study

Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density

Incorporating Tensile Stress into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

Effect of the anisotropic characteristics of β -Sn on current-induced solder evolution

Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate