Digital Speckle Correlation and its Applications

Ming LI,Jue ZHANG,Mao-ping WEN,Jing-ming LI,Ying HAO
DOI: https://doi.org/10.3969/j.issn.1672-2892.2005.01.010
2005-01-01
Abstract:A technique of full field deformation measuring,i.e.Digital Speckle Correlation (DSC) is introduced in this paper.DSC is utilized to investigate the mechanical failure behaviors of plastic bonded explosive (PBX) with preset crack subjected to compressive load.Also,DSC is employed to obtain the thermal deformation field of the assembly structures of flip chip on ceramic substrate,especially for the strain concentrating area around the solder joints.These two applications show that DSC is promising in using for full field deformation measure of materials and structures.
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