Thermal Simulation and Analysis of High Power Flip-chip Light-emitting Diodes

Wang Libin,Liu Zhiqiang,Chen Yu,Yi Xiaoyan,Ma Long,Pan Lingfeng,Wang Liangchen
DOI: https://doi.org/10.3969/j.issn.1001-5868.2007.06.005
2007-01-01
Abstract:The thermal property of high power flip-chip light-emitting diode(LED) was simulated and analyzed.The results show that the difference in temperature of the LED die are closely related with the shape and the distribution of solder bumps.The thickness of sapphire also affects the thermal property of light-emitting diode die.The comparison is given between flip-chip and conventional structure.
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