On-Chip Dipoles In Cmos For Wireless Interconnect Application

Liang Jiang,Wen‐Yan Yin,Junfa Mao

DOI: https://doi.org/10.1002/mop.23686

IF: 1.311

2008-01-01

Microwave and Optical Technology Letters

Abstract:Two new on-chip dipoles in standard 0.18-mu m CMOS are presented. The dipoles show higher inter-chip transmission gain than traditional on-chip meander dipole and smaller coverage than traditional on-chip linear dipole. Comparison between the simulated and measured SII of the on-chip dipoles indicates that the existence of metal, poly and diffusion dummies decrease the resonances. Transmission gains with different inter-chip distances and under different experiment conditions are calculated from measured S parameters, respectively. The design is helpful for the performance improvement of on-chip dipoles and the farther CMOS integration of on-chip antennas for wireless interconnect applications. (C) 2008 Wiley Periodicals, Inc.