Oxidation Behavior of Sputter-Deposited Ti–Ni Thin Films at Elevated Temperatures

Lei Zhang,Chaoying Xie,Jiansheng Wu
DOI: https://doi.org/10.1016/j.matchar.2006.06.011
IF: 4.537
2006-01-01
Materials Characterization
Abstract:The isothermal oxidation kinetics of sputter-deposited equiatomic Ti-Ni thin films in pure oxygen from 823 to 923 K is studied using thermo-gravimetric analysis. The structure, composition-depth distribution and surface morphology of oxidized Ti-Ni thin films are investigated by X-ray diffraction (XRD), Auger electron spectroscopy (AES) and atomic force microscope (AFM), respectively. The results show that the oxidation kinetics of Ti-Ni thin films obeys a near-parabolic law. TiO2, TiNi3 and parent B2 phase are the compositions of oxidized Ti-Ni thin films. A double-layered scale including the outermost layer and the Ni-rich layer is formed outside the B2 matrix of oxidized Ti-Ni thin films. Moreover, thermal oxidation induces a surface smoothening of Ti-Ni thin films and surface roughness of oxidized Ti-Ni films decreases with the increasing oxidation temperature. (c) 2006 Elsevier Inc. All rights reserved.
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