Simulation Study of the Effect of Backing on the Transient Properties of Piezoelectric Transducer

HE Taotao,LONG Shiguo,LIU Peng,LI Yao
DOI: https://doi.org/10.3969/j.issn.1004-2474.2011.01.026
2011-01-01
Abstract:The unwanted multi-reflection of the receiving signal in the piezoelectric ceramic layer of the sensor will reduce the sensitivity and resoluiton of the ultrasonic inspection system.Optimizing the backing structure and material parameters are the key to improve the receiving performance of sensor.Contrast with the traditional theory and experimental methods,the effectd of the sizes and material parameters of sensor backing structure on the transient properties of piezoelectric sensor have been optimized by Ansys software.From the modeled transient response,the elastic wave field,the electric field distribution and the output voltage response curve at different time have been given.The relationship curves about the size and material parameters of the sensor backing structure versus the sensitivity and resolution have been fitted.It has been found that the proper structure and material parameters can decreases the multi-reflection of the receiving signals and improve the receiving performance of sensor significantly.The FEM is one of the useful methods to optimize the backing structure size and the material parameters of the sensor.
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