Abstract:Polyimide aerogels display excellent mechanical strength, high thermal stability, low thermal conductivity, and outstanding dielectric properties. Typically, the synthesis of polyimide aerogels involves the polycondensation of dianhydride and diamine into poly(amic acid) (PAA) oligomers, which are then cross-linked and chemically imidized into polyimide. The stoichiometry of dianhydride and diamine determines the number of repeat units and length of the PAA oligomers, which in turn determines the cross-linking density. Despite the critical role of polymer concentration and number of repeating units in determining the microstructure and properties of polyimide aerogels, few detailed studies exist on these two parameters. Here, we synthesized and characterized 16 polyimide aerogel formulations from the common monomers biphenyl-3,3′,4,4′-tetracarboxylic dianhydride (BPDA) and 4,4′-oxydianiline (ODA), with different repeat units ( n = 5, 15, 30, 45) and total polymer concentrations (4, 7, 10, 13 wt%). An increased polymer concentration accelerated gelation and enhanced the mechanical performance of aerogels, but surprisingly, it also led to higher volumetric shrinkage during aging, solvent exchange, and supercritical drying (SCD). Specific surface areas (SSAs) reached a maximum at intermediate polymer concentrations. A shorter oligomer chain length, i.e., a higher cross-linking density, led to moderately higher SSAs (between 320 and 400 m 2 /g) and reduced shrinkage, resulting in lower densities for a given polymer concentration. The density dependence of the thermal conductivity exhibits a pronounced U -shaped curve with a minimum in thermal conductivity of 21–23 mW/(m·K) between 0.080 and 0.120 g/cm 3 , with somewhat lower values for more highly cross-linked aerogels. This systematic study of polyimide aerogels forms the basis for designing polyimide aerogels with tailored properties for targeted applications.

Effects of Monomer Structures on the Foaming Processes and Thermal Properties of Polyimide Foams

Preparation and Property of Polyimide Foams

Studies on Polyimide Foams Prepared from Poly(Ester-amine Salt) Precursor Powder

Preparation and Dielectric Properties of Polyimide Foams Containing Crosslinked Structures

Study on the Foaming Behaviors of PBS and its Modification with PA6IcoT Assisted by scCO2

Preparation and Properties of High-Temperature-Resistant, Lightweight, Flexible Polyimide Foams with Different Diamine Structures

Fabrication of rigid polyimide foams via thermal foaming of nadimide-end-capped polyester-amine precursor

Closed-Cell Rigid Polyimide Foams for High-Temperature Applications: The Effect of Structure on Combined Properties

STUDY ON THE SYNTHESIS AND PROPERTIES OF POLYIMIDE FOAMS

Effects Of Processing Conditions On Foaming Behaviors Of Polyetherimide (Pei) And Pei/Polypropylene Blends In Microcellular Injection Molding Process

INFLUENCE OF THE CHEMISTRY OF THE FOAMING COMPOSITION ON THERMAL AND MECHANICAL PROPERTIES OF THE FORMING POLYIMIDE FOAM

Effect of Isomerism on Mechanical and Tribological Properties of Thermoplastic Polyimide Films

Effect of Polymer Structure on the Morphologies and Dielectric Properties of Nanoporous Polyimide Films

Effect of polymer concentration and cross-linking density on the microstructure and properties of polyimide aerogels

Fabrication of multifunctional polyimide foams with co-polymerized benzimidazole moieties for excellent thermal insulation and flame retardancy applications

Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Mechanical and thermal properties of porous polyimide monoliths crosslinked with aromatic and aliphatic triamines

Effects of pre-imidization on rheological behaviors of polyamic acid solution and thermal mechanical properties of polyimide film: an experiment and molecular dynamics simulation

Modification of Polyimide Films by Copolymerization and Blending

Preparation of Open-Cell Rigid Polyimide Foam via Nonaqueous High Internal Phase Emulsion-Templating Technique

Mechanically strong, thermal-insulated, and ultralow dielectric polyimide aerogels with adjustable crosslinking methods