Study of the Reliability of RFID Antenna Overbridge Connection with Conductive Silver Paste

CHEN Yuan-ming,HE Wei,HE Xue-mei,MO Yun-qi,ZHOU Hua,XU Yu-shan,HE Bo
DOI: https://doi.org/10.19554/j.cnki.1001-3563.2010.15.014
2010-01-01
Abstract:The effect of thermal curing and mechanical influence of overbridge connection with conductive silver past were discussed.Each layer thickness of the overbridge connection was analyzed by slice.The effect of environmental factors to reliability of the overbridge connection was studied through flexure performance test,constant temperature and humidity test and high and low temperature thermal impact test,etc.The results show the resistance of conductive silver paste in the overbridge connection has a small variation with infrequent flexure,and the overbridge connection has good reliability to adapt to the environmental factors.
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