Phase reaction and diffusion path of the SiC/Ti system

M. Naka,J. C. Feng,J. C. Schuster
DOI: https://doi.org/10.1007/s11661-997-0275-3
1997-01-01
Metallurgical and Materials Transactions A
Abstract:Bonding of SiC to SiC was conducted using Ti foil at bonding temperatures from 1373 to 1773 K in vacuum. The total diffusion path between SiC and Ti was investigated in detail at 1673 K using Ti foil with a thickness of 50 µm. At a bonding time of 0.3 ks, TiC at the Ti side and a mixture of Ti 5 Si 3 C x and TiC at the SiC side were formed, yielding the structure sequence of β -Ti/Ti+TiC/Ti 5 Si 3 C x +TiC/SiC. Furthermore, at the bonding time of 0.9 ks, a Ti 5 Si 3 C x layer phase appeared between SiC and the mixture of Ti 5 Si 3 C x and TiC. Upon the formation of Ti 3 SiC 2 (T phase) after the bonding time of 3.6 ks, the complete diffusion path was observed as follows: β -Ti/Ti+TiC/Ti 5 Si 3 C x +TiC/Ti 5 Si 3 C x /Ti 3 SiC 2 /SiC. The activation energies for growth of TiC, Ti 5 Si 3 C x , and Ti 3 SiC 2 were 194, 242, and 358 kJ/mol, respectively.
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