Thermal Stability of SiCf/Ti60 Composites

Kong Xu,Wang Yumin,Zhang Xu,Yang Qing,Zhang Guoxing,Yang Lina,Yang Rui
2017-01-01
Rare Metal Materials and Engineering
Abstract:Thermal stability of SiCf/Ti60 composites under thermal exposure at different temperatures was studied. Interfacial reaction layer and element diffusion of SiCf/Ti60 composites after hot isostatic pressing and thermal exposure were also investigated. The results show that the interdiffusion of C or Si in SiC fiber and Ti or other elements in the matrix occurs. The main product of reaction layer is TiC at the interface and the outer layer of the TiC layer is surrounded by (Ti, Zr)(x)Si-y. TiC mainly exists on the grain boundaries in the matrix. The thickness growth behavior of SiCf/Ti60 composites reaction layer is influenced by diffusion and follows an Arrhenius law with temperature. The preexponential factor and the activation energy of SiCf/Ti60 composites are 2.27x10(-4) m/s(1/2) and 118 kJ/mol, respectively.
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