Microstructure Evolution of Interface and Matrix During the Preparation of SiCf/Ti60 Composites

Zhicong Gan,Yumin Wang,Xu Zhang,Lina Yang,Qiuyue Jia,Xu Kong,Guoxing Zhang,Qing Yang,Rui Yang
DOI: https://doi.org/10.1016/j.matchar.2024.114111
2024-01-01
Abstract:Microstructure evolution during the hot isostatic pressing (HIP) of continuous silicon carbide fiber-reinforced Ti (SiCf/Ti) composites has not been investigated. In this study, SiCf/Ti60 composites were prepared via the HIP solidification method of Ti60 precursor wires. The evolution of the microstructure of the Ti60 precursor wires and SiCf/Ti60 composites was characterized using electron backscatter diffraction microscopy and transmission electron microscopy techniques. The results showed that the deformation of alpha-Ti was mainly accomplished by basal dislocations and prismatic dislocations slip during the HIP process. After the completion of HIP, the low-angle grain boundaries (LAGBs) were reduced to 24.6%, and the average grain size of alpha-Ti was increased to 7.47 mu m(2). Two fiber textures, <0001>//axial direction (AD) and <10-10>//AD strength, were present in alpha-Ti, with a 38% increase in <10-10>//AD strength. The phase contents of 1.0% beta-Ti and 0.6% (Ti, Zr)(6)Si-3 precipitated from different locations in the Ti60 matrix and induced changes in misorientation.
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